Products

Laser separation (glass, ceramics, semiconductor)

JENOPTIK-VOTAN™ G

In the product line JENOPTIK-VOTAN™ G (Glass), the laser processes brittle materials like glass, ceramics or semiconductor. Specific areas of application are display glasses, substrate ceramics and thin film solar cells.

Thermal Laser Separation (TLS)

The laser beam heats up the surface, whereby compressive stress is induced into the material.
Directly after the laser beam, a coolant is applied to the surface, causing tensile stress in the material.
Starting from the initial crack, a crack propagates along the working line.
The workpiece can then be broken mechanically in a separate work step.

With the TLS technique, brittle materials can be scribed and broken (Scribe & Break) or be cut through entirely (Full Cut).

Laser Beam Induced Separation (LBIS)

Heating of the glass by passing the laser beam several times through the material volume
This partially heats up the glass and causes an expansion of the volume.
The result is a defined crack along the cutting line, which runs through the entire thickness of the material.

With the LBIS technique, glass can be cut through completely (Full Cut).