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Laser separation (glass, ceramics, semiconductor)

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In the product line JENOPTIK-VOTAN™, the laser processes brittle materials like glass, ceramics or semiconductor. Specific areas of application are display glasses, substrate ceramics and thin film solar cells.



Thermal Laser Separation (TLS)

  • The laser beam heats up the surface, whereby compressive stress is induced into the material.
  • Directly after the laser beam, a coolant is applied to the surface, causing tensile stress in the material.
  • Starting from the initial crack, a crack propagates along the working line.
  • The workpiece can then be broken mechanically in a separate work step.

With the TLS technique, brittle materials can be scribed and broken (Scribe & Break) or be cut through entirely (Full Cut).

Laser Beam Induced Separation (LBIS)

  • Heating of the glass by passing the laser beam several times through the material volume
  • This partially heats up the glass and causes an expansion of the volume.
  • The result is a defined crack along the cutting line, which runs through the entire thickness of the material.

With the LBIS technique, glass can be cut through completely (Full Cut).

Advantages

  • Glass edge free of micro-cracks
  • Undamaged surface coatings
  • Flexural strength up to 50% higher than with conventional cutting methods
  • No further processing steps (grinding, polishing) required
  • Adjustable breaking force (only with TLS)
  • Contactless process
  • No tool wear
  • High degree of automation possible

Single-pane safety glass

Purath

Dr. Andreas Purath

JENOPTIK Automatisierungstechnik GmbH
Stellvertr. Leiter Vertrieb Photovoltaik/Elektronik

  • +49 3641 65-2611
  • +49 3641 65-3408
Riedel(1)

Christian Riedel

JENOPTIK Automatisierungstechnik GmbH
Produktmanager Photovoltaik/Elektronik

  • +49 3641 65-2539
  • +49 3641 65-3408